一、会议-ISSCC,VLSI,CICC,ESSCIRC,RFIC,A-SSCC
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ISSCC-IEEE International Solid-State Circuits Conference，国际固态电路会议，是世界学术界和企业界公认的集成电路设计领域最高级别会议，被认为是集成电路设计领域的“世界奥林匹克大会”。（顶会，每年仅有200篇左右）
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VLSI-IEEE Symposia on VLSI Technology and Circuits，超大规模集成电路研讨会
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ESSCIRC-European Solid-State Circuit Conference，欧洲固态电路会议
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RFIC-IEEE Radio Frequency Integrated Circuits Symposium，射频集成电路研讨会
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CICC-IEEE Custom Integrated Circuits Conference，集成电路会议
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ASSCC-IEEE Asian Solid-State Circuits Conference，亚洲固态电路会议
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ISCAS-IEEE International Symposium on Circuits and Systems，国际电路与系统研讨会
ISSCC > VLSIC > ESSCIRC/CICC/RFIC > ASSCC > ISCAS > 各种local CAS (APCCAS, MWSCAS等)
二、期刊-IEEE JSSC,IEEE SSCL,IEEE TCAS-I,IEEE TCAS-II,IEEE TMTT,IEEE MWCL,IEEE TVLSI,IEEE TbCAS,IEEE Sensor Journal
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IEEE JSSC-IEEE Journal of Solid-State Circuits ，IEEE固态电路期刊。（顶刊 SCI 1区）
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IEEE SSCL-IEEE Solid-State Circuits Letters ，18年创刊，档次很高，只收流片结果，和JSSC有相同的审稿标准，首任主编Behzad Razavi。
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IEEE TCAS-I-IEEE Transactions on Circuits and Systems I（SCI 2区）
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IEEE TCAS-II-IEEE Transactions on Circuits and Systems II（SCI 2区）
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IEEE TMTT-IEEE Transactions on Microwave Theory and Techniques（SCI 1区）
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IEEE MWCL-IEEE Microwave and Wireless Components Letters（SCI 2区）
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IEEE TVLSI-IEEE Transactions on Very Large Scale Integration（SCI 2区）
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IEEE TBCAS-IEEE Transactions on Biomedical Circuits and Systems（SCI 2区）
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IEEE Sensor Journal-SCI期刊，中科院杂志分区工程：电子与电气分类下的 3 区期刊。
会议
IEEE International Solid-State Circuits Conference，简称：ISSCC，国际固态电路会议
IEEE International Electron Devices Meeting，简称：IEDM，国际电子器件会议
IEEE Symposia on VLSI Technology and Circuits，简称：VLSI，超大规模集成电路研讨会
European Solid-State Circuit Conference，简称：ESSCIRC，欧洲固态电路会议
IEEE Asian Solid-State Circuits Conference，简称：A-SSCC，亚洲固态电路会议
Hot Chips: A Symposium on High Performance Chips，简称：Hot Chips，高性能芯片研讨会
IEEE International Symposium on Circuits and Systems，简称：ISCAS，电路系统研讨会
IEEE/ACM International Symposium on Microarchitecture，简称：MICRO，微架构
International Symposium on Computer Architecture，简称：ISCA，计算机体系架构
International Symposium on High-Performance Computer Architecture，简称：HPCA，高性能计算机架构
International Conference on Architectural Support for Programming Languages and OperatingSystems，简称：ASPLOS，编程语言和操作系统的体系结构支持国际会议
Design Automation Conference，简称：DAC，设计自动化会议
IEEE International Symposium on Power Semiconductor Devices and ICs，简称：ISPSD，功率器件、电路研讨会
IEEE Radio Frequency Integrated Circuits Symposium，简称：RFIC，射频集成电路研讨会
IEEE Custom Integrated Circuits Conference，简称：CICC，集成电路会议
IEEE International Conference on Computer-aided Design ，简称：ICCAD，计算机辅助设计国际会议
ACM/IEEE International Symposium on Low Power Electronics and Design，简称：ISLPED，低功耗电子设计研讨会
Design, Automation and Test in Europe Conference and Exhibition，简称：DATE，欧洲设计、自动化、测试会议
期刊
IEEE Journal of Solid-State Circuits ，简称：JSSC
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems，简称：TCAD
IEEE Transactions on Circuits and Systems I，简称：TCAS-I
IEEE Transactions on Circuits and Systems II，简称：TCAS-II
IEEE Transactions on Very Large Scale Integration ，简称：TVLSI
ELECTRONICS LETTERS，简称：EL